Leaked real-world Geekbench 6, AnTuTu V11, and 3DMark benchmarks shared by tipster Ice Universe reveal that Xiaomi’s custom 3nm XRING O3 mobile processor surpasses expectations–topping 15,200 points in multi-core compute and over 5.2 million on AnTuTu, effectively rivaling desktop-class silicon ahead of its debut in the Xiaomi 18 Fold.
When Xiaomi first announced it was developing a custom 3nm processor to power its upcoming flagship hardware, many industry observers anticipated a conservative first-generation effort. However, newly surfaced real-world test results shared by a renowned tech insider via a post on X show that the XRING O3 is poised to be an outright performance powerhouse. Fabricated on TSMC’s advanced N3P process, early validation runs show the silicon matching Apple’s current single-core threshold while setting unprecedented multi-threaded and graphical records in the Android ecosystem. These tests show results of XRING O3 on a tablet platform; the results on phones such as Xiaomi Fold 18 or Xiaomi’s next flagship might be different.
Why Xiaomi’s XRING O3 is true rival of other flagship SOCs
According to testing metrics shared across Geekbench 6 and AnTuTu V11, the XRING O3 delivers numbers previously unseen on Android smartphone processors. As soon as ICE Universe posted the benchmark results, the internet instantly started comparing it to the likes of Google’s Tensor G6 and Snapdragon 8 Elite Gen 5. And in Xiaomi’s fairness, the numbers are actually very promising.
The first real-device Geekbench result for the Xiaomi XRING O3 is here.
— Ice Universe (@UniverseIce) August 31, 2026
Device: Xiaomi Pad 9 Pro Max
Geekbench 6.7.1
Single-core: 3,474
Multi-core: 13,229 pic.twitter.com/fHp7e82GXO
Geekbench 6 Single-Core: The chip reaches scores between 3,710 and 3,945 points, putting its primary performance cores in direct parity with current high-end Apple tablet and phone silicon.
Geekbench 6 Multi-Core: Leveraging an aggressive 10-core topology, the processor scores an astonishing 15,221 points--surpassing current flagship rivals by more than 45%.
**AnTuTu V11 Benchmark: **The overall platform score breaks the 5-million threshold for the first time on mobile, hitting 5.22 million points.
3DMark Solar Bay Extreme (Ray Tracing): Driven by its 16-core Arm G2-Ultra NX GPU, the chip posted 3,628 points, a 51% uplift over Apple’s A19 Pro.
10-Core microarchitecture and massive 44MB cache
The benchmark success is underpinned by radical architectural choices. Rather than adhering to conventional mobile CPU layouts, Xiaomi configured the XRING O3 with a wide 10-core cluster consisting of two Arm C1-Ultra prime cores clocked at 4.35GHz, four C1-Premium cores at 3.68GHz, and four C1-Pro efficiency cores at 3.15GHz.
Xiaomi’s Xring O3 has achieved an AnTuTu score of 5.22 million, far surpassing every smartphone processor currently available. Its GPU performance has improved by a massive 85%. The chip features six ultra-large CPU cores plus four additional cores, and is also the first to… pic.twitter.com/ox8mOFpZLX
— Ice Universe (@UniverseIce) August 24, 2026
Crucially, researchers and hardware analysts pointed out that Xiaomi allocated massive silicon surface area to on-die memory, equipping the processor with an enormous 44MB total system cache--a pool larger than many x86 laptop processors. Paired with CXMT’s newly mass-produced LPDDR6 memory operating on a quad 24-bit bus at 10,667 to 12,800 Mbps (yielding up to 113.8 GB/s of bandwidth), the architecture drastically minimizes memory latency penalties, accelerating on-device local AI models, web execution, and graphic workloads.
What about thermals on Xiaomi XRING O3?
While the lab test runs demonstrate what the architecture can achieve unconstrained, industry analysts emphasize that retail execution will face thermal hurdles. Packing six large CPU cores clocked above 3.6GHz inside a thin folding chassis like the Xiaomi 18 Fold creates severe thermal dissipation challenges within a standard 4-to-6-watt mobile envelope. Sustained retail performance will depend entirely on how aggressively Xiaomi’s cooling vapor chambers manage thermal throttling during prolonged gaming sessions and multi-frame AI model passes.
After seeing the almost alien-level power efficiency of Xiaomi’s Xring O3, I’m starting to worry about those upcoming 2nm chips. https://t.co/RZAvKfE2xM pic.twitter.com/gWYFTpuYtD
— Ice Universe (@UniverseIce) August 24, 2026
The XRING O3 benchmarks prove that Xiaomi’s in-house silicon ambitions are far past the experimental phase; this is an all-out assault on the mobile compute hierarchy. Backing a 10-core cluster with a laptop-sized 44MB cache and blazing 113.8 GB/s LPDDR6 bandwidth fundamentally reshapes the economics of edge AI and mobile multitasking. If Xiaomi can keep this 3nm beast cool inside the thin chassis of the 18 Fold without aggressive thermal throttling, Qualcomm and MediaTek will find their duopoly under immediate, unprecedented threat.
(Feature image credits to Xiaomi.)
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